Services Overview
ASAT offers a definitive selection of semiconductor specialized services including test, design and analysis.
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ASAT's test capabilities in mixed-signal, RF, and high-speed digital devices allow the Company to meet the increased demand for outsourced IC package testing. With 50,000 square feet of production test floor, and another 50,000 square feet ready for expansion, ASAT is ready to support your growing IC package test needs. |
Package design has become a critical element in semiconductor manufacturing, impacting device performance as well as board-level and system integration. ASAT's design operations provide state-of-the-art packaging design tools and highly qualified design engineers required to support all types of lead frame and ball grid array packages (flip chip, fine pitch, multi-chip, stacked-die, cavity-down, etc.). |
Analysis: Modeling and Measurement |
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The Company's electrical and thermal engineers are masters of analysis and provide a variety of measured or modeled data for any ASAT package. We have United States based centers for faster customer service.