Package Design Checklist
Package Design
- Overview
- Concurrent Design Flow
Package design has become a critical element in semiconductor manufacturing, impacting device performance as well as board-level and system integration. ASAT's design operations provide state-of-the-art packaging design tools and highly qualified design engineers required to support all types of lead frame and ball grid array packages (flip chip, fine pitch, multi-chip, stacked-die, cavity-down, etc.). These capabilities are backed by ASAT’s worldwide design centers, which offer satellite design support for immediate personalized package design needs.
ASAT’s quick package design feasibility and turnaround cycle times significantly reduce product development and time to market for our customers. In addition, ASAT offers flexible design rules and substrate technologies that can be used to tailor device and application requirements. ASAT assesses the manufacturability of each product by tracking the design process flow from beginning to end. In addition, our design engineers review customer designs with the assembly/development engineering groups, ensuring a reliable and manufacturable product that meets each customer’s requirements.
ASAT design engineers take into account the following electrical requirements:
ASAT Design Centers
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ASAT Design Tools
ASAT Design Input and Output Formats
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