Package Design

Package design has become a critical element in semiconductor manufacturing, impacting device performance as well as board-level and system integration. ASAT design operations provide state-of- the-art packaging design tools and highly qualified design engineers required to support all types of lead frame, flip chip and modular package designs.

ASAT's quick package design feasibility and turnaround cycles significantly reduce product development time to market for our customers. Using ASAT's Design Tracking System (DTS), ASAT assesses the ability to manufacture each product by tracking the design process flow from beginning to end. In addition, our design engineers review customer designs with the assembly engineering group, ensuring a reliable and manufacturable product that meets each customers electrical, mechanical and thermal performance requirements.