The Company's electrical and thermal engineers are masters of analysis and provide a variety of measured or modeled data for any ASAT package. We have United States based centers for faster customer service.
Click here to download the Modeling Services data sheet.
ASAT is an industry leader in providing advanced thermal modeling and measurement services for semiconductor packages, including a modeling and measurement lab with extensive capabilities for either thermal or for customer active die.
ASAT Thermal, Modeling, Stress Modeling and Simulation Tools
• IcePak from Ansys, Inc.
• Ansys Mechanical from Ansys, Inc.
ASAT Thermal Measurement Lab
• Thermal Analyzer from AnaTech Corp.
• Wind Tunnel from AnaTech Corp.
• JEDEC still air chamber from AnaTech Corp.
• JEDEC theta-jc set up from AnaTech Corp.
• JEDEC liquid-cooled theta-jb set up from AnaTech Corp.
• Thermal Test Die from Delco Corp.
With increases in bandwidth requirements and the rapid growth of high-speed device applications, accurate FEM modeling has become ASAT's standard process for ensuring and predicting package-level electrical performance.
ASAT Electrical Modeling and Simulation Tools
• Paksi-E® from ADS Inc.
• Cam350 from Advanced CAM Technologies
• HFSS™, Serenade®, Harmonica® from Ansoft Corp.
• Spicelink™ from Ansoft Corp.
• Maxwell® 2D, 3D from Ansoft Corp.
• Full-Wave™ Spice™, Optimetrics™ from Ansoft Corp.
• AnsoftLinks™ with Encore Avant! from Ansoft Corp.
• ParIC® from Ansoft Corp.
• PEEC from Ansoft Corp.