Analysis: Modeling and Measurement

ASAT’s modeling group utilizes advanced Finite Volume and Finite Element software tools to perform highly accurate simulations on sophisticated packages. These simulations are based on 3D CFD analysis with advanced solvers like IcePAK® and Ansys® Mechanical. IcePak® is the standard platform for thermal simulation. Ansys® Mechanical is used to model thermally induced stresses in packages. Plus, all simulations are based on applicable JEDEC standards, allowing IC-, package-, board- and system-level simulation. Additional features—such as heatsinks, fans and vents—can also be incorporated into thermal solutions.

ASAT’s thermal measurement lab is equipped with advanced set ups specializing in package characterization. All measurements follow JEDEC standards and can be performed on thermal or active die. In addition, the lab features wind tunnels for thermal characterization at air speeds from 0 to 1000 lfpm (0-5 m/s), as well as a JEDEC standard still air chamber for use in theta-ja measurement. Specialized theta-jc and liquid-cooled theta-jb set ups are also available to provide advanced package measurement.

 Thermal and Electrical Modeling/Measurement Services: Overview

ASAT Thermal, Modeling, Stress Modeling and Simulation Tools

• IcePak from Ansys, Inc.
• Ansys Mechanical from Ansys, Inc.

ASAT Thermal Measurement Lab

• Thermal Analyzer from AnaTech Corp.
• Wind Tunnel from AnaTech Corp.
• JEDEC still air chamber from AnaTech Corp.
• JEDEC theta-jc set up from AnaTech Corp.
• JEDEC liquid-cooled theta-jb set up from AnaTech Corp.
• Thermal Test Die from Delco Corp.

With increases in bandwidth requirements and the rapid growth of high-speed device applications, accurate FEM modeling has become ASAT’s standard process for ensuring and predicting package-level electrical performance. Our electrical characterization teams have enhanced their modeling techniques and software to support full package modeling and high-frequency modeling services. This enables us to provide full package characteristics and high-frequency signal reactant for package-level critical signal paths. Electrical measurement instruments and methodologies provide additional solid-state verification and results on actual packages.

ASAT’s electrical modeling and simulation services also allow the end users’ systems or product engineers to accurately predict the electrical package characteristics, then select the appropriate package for their requirements. With accurate package characterization, the design cycles are significantly reduced which, in turn, reduces the effective time to market for new applications. By reducing the design cycle of the package, the cycle time for finalizing the system and application requirement is greatly enhanced.

 Thermal and Electrical Modeling/Measurement Services: Overview

ASAT Electrical Modeling and Simulation Tools

• Paksi-E® from ADS Inc.
• Cam350 from Advanced CAM Technologies
• HFSS™, Serenade®, Harmonica® from Ansoft Corp.
• Spicelink™ from Ansoft Corp.
• Maxwell® 2D, 3D from Ansoft Corp.
• Full-Wave™ Spice™, Optimetrics™ from Ansoft Corp.
• AnsoftLinks™ with Encore Avant! from Ansoft Corp.
• ParIC® from Ansoft Corp.
• PEEC from Ansoft Corp.