Additional Product Information
TLA: Data Sheet
Typical TLA Applications
- Analog, RF, ASIC and Power Management
- Mobile Phones
- Netbooks
- Other Handheld Portable Devices
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TLA™
Thermal Leadless Array
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ASAT's evolutionary leadless package, the TLA™, is the next generation in leadframe packaging. TLA achieves up to 75% reduction in board area as well as dramatically reducing total signal and wire lengths. At a lower cost per I/O than traditional wire bonded packages, the TLA has the highest I/O count per body size in a lead frame based package. The TLA is able to replace QFPs, single and dual row QFNs, QFPs, and FPBGAs.
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Typical Package Configurations* (0.40, 0.50, 0.65 mm pitch shown)
BODY SIZE |
NO. OF ROWS |
LEADCOUNT |
DAP SIZE* |
||||
0.40 mm |
0.50 mm |
0.65 mm |
0.40 mm |
0.50 mm |
0.65 mm |
||
2 x 2 |
1 |
12 |
12 |
-- |
0.80 |
0.70 |
-- |
3 x 3 |
1 |
24 |
20 |
-- |
1.80 |
1.70 |
-- |
4 x 4 |
2 |
52 |
44 |
28 |
1.80 |
1.80 |
N/A |
3 |
-- |
-- |
-- |
-- |
-- |
-- |
|
5 x 5 |
2 |
76 |
60 |
36 |
2.80 |
2.80 |
2.20 |
3 |
96 |
80 |
-- |
1.80 |
1.80 |
-- |
|
6 x 6 |
2 |
92 |
76 |
52 |
3.80 |
3.80 |
3.20 |
3 |
120 |
104 |
-- |
2.80 |
2.80 |
-- |
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7 x 7 |
2 |
116 |
92 |
68 |
4.80 |
4.80 |
4.20 |
3 |
156 |
128 |
-- |
3.80 |
3.80 |
-- |
|
8 x 8 |
2 |
132 |
108 |
76 |
5.80 |
5.80 |
5.20 |
3 |
180 |
152 |
-- |
4.80 |
4.80 |
-- |
|
9 x 9 |
2 |
156 |
124 |
92 |
6.80 |
6.80 |
6.20 |
3 |
216 |
176 |
-- |
5.80 |
5.80 |
-- |
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10 x 10 |
2 |
172 |
140 |
100 |
7.80 |
7.80 |
7.20 |
3 |
240 |
200 |
-- |
6.80 |
6.80 |
-- |
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11 x 11 |
2 |
196 |
156 |
196 |
8.80 |
8.80 |
8.20 |
3 |
276 |
224 |
-- |
7.80 |
7.80 |
-- |
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12 x 12 |
2 |
212 |
172 |
124 |
9.80 |
9.80 |
9.20 |
3 |
300 |
248 |
-- |
8.80 |
8.80 |
-- |
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13 x 13 |
2 |
236 |
188 |
140 |
10.80 |
10.80 |
10.20 |
3 |
336 |
272 |
-- |
9.80 |
9.80 |
-- |
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15 x 15 |
2 |
276 |
220 |
164 |
12.80 |
12.80 |
12.2 0 |
3 |
396 |
320 |
-- |
11.80 |
11.80 |
-- |
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