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TBGA/CLTBGA

Tape Ball Grid Array / Closed-Loop Tape Ball Grid Array

LPCC Developed and patented in 1995, ASAT’s TBGA and CLTBGA packages provide the industry with a higher performance solution to PBGA. ASAT’s TBGA package is an excellent choice for applications requiring enhanced thermal and electrical performance. ASAT’s CLTBGA option provides solid electrical ground for improved signal-to-noise ratio and reduced ground inductance. The ultra-fine metal line width and spacing allows most designs to be routed on one metal layer. A two-metal option provides multiple power supply rings and improved routability for higher ball count applications, typically above 600.

Features

Body sizes from 15 to 45 mm SQ
Lead counts from 46 to 792
Die-down configuration
One to two metal layer tape design, with and without bussing
Ground ring on heat spreader or tape
Option for electrically conductive spot on cavity
Conforms to JEDEC registered
outlines for MO-149
Controlled impedance / differential pairs capability

Advantages

Best thermal performance in class
JEDEC standard body sizes and ball counts
High performance (thermal/electrical and design density)
Internal heat spreader as ground plane and EMI shield
Low tooling cost (open tool designs also available)
Fast design to productio

Typical Cross Section

PBGA

Typical Package Configuration

Ball Pitch 1.00
Body Size	Ball Count
15 x 15	90, 92, 96, 120
21 x 21	256
23 x 23	228
25 x 25	320, 380
27 x 27	276, 352
31 x 31	324, 484
35 x 35	564, 580
37.5 x 37.5	396
40 x 40	680
42.5 x 42.5	728

Ball Pitch 1.27
Body Size	Ball Count
21 x 21	156, 192
23 x 23	195, 208
25 x 25	218, 240
27 x 27	256, 266, 298
31 x 31	304, 320
35 x 35	56, 59, 352, 356, 368, 420, 440, 504
37.5 x 37.5	46, 400, 480, 584
40 x 40	520, 600, 672, 792
45 x 45	652, 784