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A revolutionary new concept, ASAT's TAPP® is a leadless, Pb-free and multi-row packaging solution. The very thin, fine-pitch package with an exposed die attach pad allows for improved thermal performance and a power/ground ring option for enhanced electrical characteristics. The TAPP® offers a superior solution for high-performance and chip scale applications.
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- Body sizes from 2 to 10 mm SQ*
- Lead counts from 8 to 72
- Standard assembly materials, equipment and processes
- Ground plane bonding option
- Conforms to JEDEC registered outlines for QFN (MO-220) and SON (MO-229)
- Dual-in-line versions available
- 0.4 mm, 0.5 mm and 0.65 mm thickness options per JEDEC outline MO-248
- Bumped LPCC available per JEDEC outline MO-250
- Stacked die option available
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- Moisture Sensitivity Level One (MSL-1) and “green” options available
- Lowest stress at solder joint compared to CSP & Flex packages
- Saw singulation technique provides larger die pads for better thermal performance
- Very low inductance for high-speed applications
- Ten day design cycle time including lead frame
- Immune to die shrink
- Die pad mounting to motherboard provides for excellent thermal performance
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