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Stacked Die

LPCC With the industry's increasing demand for lower costs, smaller products and additional features, ASAT introduced a new line of packaging solutions utilizing its core competencies in package design and assembly processes. Using state-of-the-art wafer backgrinding, thin wafer handling, die attach and wirebond assembly processes, two or more dice can be stacked within a single package. Several of the die stacks can also be assembled and electrically interconnected within the package.

Features/Capabilities

3-mil full auto backgrind capability
Die-to-die mounting with thick epoxy
Ultra low-loop wirebonding
Reverse ball-to-ball bonding (BSOB)
Die-to-die mounting with film adhesive
Die-to-die wirebonding

Advantages

Real estate and weight saving
Shorter electrical paths
Die to die bonding/interface within the package
Higher package density
Multiple wafer fab technology chips in one package

Typical Cross Section

Stacked