Stacked Die

With the industry's increasing demand for lower costs, smaller products and additional features, ASAT introduced a new line of packaging solutions utilizing its core competencies in package design and assembly processes. Using state-of-the-art wafer backgrinding, thin wafer handling, die attach and wirebond assembly processes, two or more dice can be stacked within a single package. Several of the die stacks can also be assembled and electrically interconnected within the package.

Contact your local sales representative for more information.