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SiP

System-in-Package

LPCC With its core competencies in advanced package design, assembly and testing, ASAT is qualified to meet the electronics industry's demand for higher levels of integration, cost effectiveness and better electrical performance. Using state-of-the-art design tools and electrical simulation, single or multiple chips, passive components and discrete devices can be designed into a standard or custom package. These elements can be electrically interconnected to the substrate in both chip form (wire bond or flip chip options available) and pre-tested assembled monolithic packages. Various leaded, array and leadless package formats are supported.

Features

Leaded, array and leadless form factors
Die only, tested packages and component configurations
Laminate (plated through hole and build-up) ceramic, lead frame substrates and TAPP technology
Flip chip, wire bond, silicon on silicon, and stacked assembly options
EIA 0201 and 0402 passives

Advantages

High-performance network interface
Motion sensors
Imaging applications
Multimedia cards
Handheld electronics
RF applications
Automatic test equipment

Typical Cross Section

QFP

Leaded SiP

BGA

BGA SiP