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System-in-Package
Using state-of-the-art design tools and electrical simulation, single or multiple chips, passive components and discrete devices can be designed into a standard or custom package. Various leaded, array and leadless package formats are supported. Learn more...
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Products Overview
With a strong intellectual property portfolio (57 issued patents and more pending), ASAT offers a broad package portfolio including; QFN, TAPP, TLA, Standard and Thermal QFP, fine-pitch and ultra-thin fine pitch BGA, flip chip, Tape BGA, stacked die, and system-in-package. ASAT's leading edge technology also includes ultra low loop 2-mil wirebonding, thin QFN, SiP and Stacked Die programs. With technology agreements with large subcontractors, ASAT can support a wide array of packaging technologies. ASAT is leader in JEDEC subcommittees and other industry organizations.
| Leadless • QFN: LPCC | TLA | TAPP • DFN |
CSP • fpBGA | Thin fpBGA • LGA |
| Standard Leaded • LQFP • MQFP • TQFP |
Thermally Enhanced Leaded • EDQUAD LQFP • EDQUAD MQFP • EPP • INT-TEP • INT-HS |
| BGA • PBGA • TBGA /CLTBGA • EBGA |
Flip Chip • Overmold • Bare Die • Heatsink |
| System-in-Package • SiP |
Stacked Die • Stacked DIe |