The section contains Standard Leaded, Thermally Enhanced, Stacked Die, MCM and SiP products configurations.
Click here to learn more about ASAT's leaded products.
Leaded Offerings
MQFP LQFP EPP EDQUAD LQFP EDQUAD MQFP INTEGRATED HEATSPREADERS
The Array section contains Standard Array, Thermally Enhanced, Flip Chip, Stacked Die, SiP and MCM product configurations.
Click here to learn more about ASAT's Array products.
Array Offerings
TBGA/CLTBGA fpBGA PBGA EBGA
As performance requirements, such as high-speeds, smaller IC footprint, increased I/O, and bump densities, continue to drive flip chip technology forward, ASAT, with its leading edge approach to packaging and diversified customer base, will continue to advance its flip chip capabilities. ASAT's flip chip experience and technological expertise will help you sort through the wide variety of available substrate technologies and materials to determine the most efficient technology for your application.
Click here to learn more about ASAT's Flip Chip.
Request more information.
If you would like to talk with an ASAT representative, fill out the online form and someone will get back to you shortly.
The Leadless section contains formats in QFN single row IO and QFN multiple row IO's products, as well as LGA. Also available in SiP, MCM (Multi Chip Modules) and Stacked Die product configurations.
Click here to learn more about ASAT's leadless products.
With its core competencies in advanced package design, assembly processes and packaging, ASAT is uniquely qualified to meet the electronics industry's demand for higher levels of integration, cost effectiveness and better electrical performance. Using state-of-the-art design tools, one or more ICs, passive components and discrete devices can be designed into a standard or custom package. These elements can be electrically interconnected to the substrate in both chip form (wire bond or flip chip options available) and pre-tested assembled monolithic packages.
Click here to learn more about ASAT's SiP technology