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Additional Product Information

PBGA: Data Sheet

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Typical PBGA Applications

  • Microprocessors
  • Networking chip sets
  • Personal computer chip sets
  • Graphics, DSPs

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PBGA

Plastic Ball Grid Array

LPCCThe PBGA provides electrical and design enhancements over leaded packages. Using ASAT’s design and modeling services, 2-6L laminate can be designed with power and ground planes for enhancing thermal and electrical performance. ASAT’s PBGA is available as open tooled or custom laminate with the option of standard eutectic or lead free material sets.

Features

  • Body sizes from 11 to 35 mm SQ
  • Lead counts from 84 to 484
  • 2L or 4L laminate
  • Ball pitch 1.0 mm/1.27/15 mm
  • Die-up configuration

Advantages

  • Performance adders—ground/
    power planes
  • Low inductance, improved thermals
  • JEDEC compliant
  • Standard eutectic or lead free
    material set available

Typical Cross Section

PBGA

Typical Package Configuration

BODY SIZE (mm)
BALL COUNT
PITCH (mm)
13 x 13
144
1.0
15 x 15
196
1.0
14 x 22
119/153
1.27
23 x 23
169
1.5
23 x 23
208/217
1.27
27 x 27
225
1.5
27 x 27
256/272
1.27
35 x 35
352/388
1.27