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Product Information

Thermally Enhanced Leaded Packages: Data Sheet

Request

Bonding Diagrams / MODs

Typical MQFP Applications

  • Gate arrays and logic devices
  • Computer chipsets
  • Graphics, DSP, ASICs

Contact an ASAT Representative

Standard Leaded Products: MQFP

Metric Plastic Quad Flat Pack

ASAT QFPASAT offers MQFP in various body sizes, lead counts, body thicknesses and footprints. Open-tooled lead frames are available for various die sizes, both in die-up and die-down configurations. Custom lead frame designs are also supported. All standard leaded packages are offered with MSL-1 and lead-free assembly options. Electrical performance enhancement option is available with the addition of an interposer ring.

Features

  • QFP lead counts from 16 to 240
  • Optional single or multiple
    interposer ring

Advantages

  • MSL-1 technology available
  • Wide range of open-tooled
    lead frames
  • Lead-free option available
  • Interposer ring options provide power/ground rings
  • Multi-chip capability

Typical Cross-Section: (MQFP with Multiple Interposer Rings)

QFP

Typical Package Configurations

Type

Body Size

Body Thickness

Footprint

External Lead Pitch

Lead Count

JEDEC Reference Outline

MQFP

10 x 10

2.0

3.2/3.9/4.1

0.8/0.65/0.5

44/52/64

MO108/MO112

MQFP

14 x 14

2.0/2.7

2.0/2.6/3.2/3.9

1.0/0.8/0.65/0.5

44/52/64/80/100

MS022/MO108/MO112

MQFP

14 x 20

2.0/2.7

3.2/3.6/3.9

1.0/0.8/0.65/0.5

64/80/100/120/128

MS022/MO112

MQFP

28 x 28

3.49

2.6/3.2/3.9

0.8/0.65/0.5

120/128/144/160/184/208

MS022/MS029/MO112

MQFP

32 x 32

3.5

2.6/3.2

0.65/0.5

184/240

MO108/MS029

LQFP

5 x 5

1.4

2.0

0.8/0.5

20/32

MS026

T/LQFP

7 x 7

1.0/1.4

2.0

0.8/0.5

32/48

MS026

T/LQFP

10 x 10

1.0/1.4

2.0

0.8/0.65/0.5

44/52/64

MS026

T/LQFP

14 x 14

1.0/1.4

2.0

1.0/0.8/0.65/0.5/0.4

44/52/64/80/100/120/128

MS026

LQFP

14 x 20

1.4

2.0

1.0/0.8/0.65/0.5

64/80/100/120/128

MS026

LQFP

20 x 20

1.4

2.0

0.5/0.4

144/176

MS026

LQFP

24 x 24

1.4

2.0

0.5

160/176

MS026