LPCC™ / QFN
Leadless Plastic Chip Carrier
Typical Cross Section
|
Typical Package Configurations
Body Size |
Pitch |
Lead Count |
Exposed DAP Size* |
Max Die Size (w/o DB)* |
Max Die Size (w/ DB) |
Min Die Size* |
Package Thickness |
3 x 3 |
0.65 |
8/16 |
65 x 65 |
65 x 65 |
35 x 35 |
35 x 3 5 |
0.90/0.75 |
3 x 3 |
0.5 |
12/16 |
65 x 65 |
65 x 65 |
35 x 35 |
35 x 35 |
0.90/0.75 |
4 x 4 |
0.65 |
12/16 |
104 x 104 |
104 x 104 |
74 x 74 |
35 x 35 |
0.90/0.75 |
4 x 4 |
0.5 |
20/24 |
104 x 104 |
104 x 104 |
74 x 74 |
35 x 35 |
0.90/0.75 |
4 x 5 |
0.5 |
24/28 |
104 x 144 |
104 x 144 |
74 x 114 |
35 x 35 |
0.90/0.75 |
5 x 5 |
0.65 |
20/24 |
144 x 144 |
144 x 144 |
114 x 114 |
35 x 35 |
0.90/0.75 |
5 x 5 |
0.5 |
28/32 |
144 x 144 |
144 x 144 |
114 x 114 |
35 x 35 |
0.90/0.75 |
6 x 6 |
0.65 |
24/28/32 |
183 x 183 |
183 x 183 |
153 x 153 |
73 x 73 |
0.90/0.75 |
6 x 6 |
0.5 |
36/40 |
183 x 183 |
183 x 183 |
153 x 153 |
73 x 73 |
0.90/0.75 |
7 x 7 |
0.65 |
32/36 |
222 x 222 |
222 x 222 |
192 x 192 |
112 x 112 |
0.90/0.75 |
7 x 7 |
0.5 |
40/44/48 |
222 x 222 |
222 x 222 |
192 x 192 |
112 x 112 |
0.90/0.75 |
8 x 8 |
0.65 |
36/40/44 |
261 x 261 |
261 x 261 |
232 x 232 |
151 x 151 |
0.90/0.75 |
8 x 8 |
0.5 |
48/52/56 |
261 x 261 |
261 x 261 |
232 x 232 |
151 x 151 |
0.90/0.75 |
9 x 9 |
0.65 |
44/48 |
301 x 301 |
296 x 296 |
271 x 271 |
191 x 191 |
0.90/0.75 |
9 x 9 |
0.5 |
56/60/64 |
301 x 301 |
296 x 296 |
271 x 271 |
191 x 191 |
0.90/0.75 |
10 x 10 |
0.5 |
68/72 |
236 x 236 |
234 x 234 |
204 x 204 |
134 x 134 |
0.90/0.75 |


The LPCC patented plastic package was developed by ASAT in 1998, introducing a "leadless" concept into ASAT's expanding portfolio. The LPCC package is a superior choice for high-speed applications where thermal and electrical performance is paramount and space constraints are unavoidable. For thermal solutions, this package has the ability to mount the die attach pad directly to the board for heat dissipation. 