Internet Resources
Partners, Memberships, and Alliances
- Fabless Semiconductor Association
- Teradyne
- MEPTEC (Microelectronic Packaging and Test Engineering Council)
Industry Sites
- JEDEC
- JEITA (Japan Electronics and Information Technology Industries Association)
- IMAPS (International Microelectronics and Packaging Society)
- IPC (Institute for Interconnecting and Packaging Electronic Circuits)
- SEMI (Semiconductor Equipment and Materials International Association)
- Internet Search for Electronic Components.
Publications
- Surface Mount Technology
- Advanced Packaging
- EE Times
- IEEE (Institute of Electrical and Electronics Engineers, Inc.)
- PR Newswire
- Business Wire
Technical Library
| Title | Report No. | Size | Type |
| The Improvement of Thermal Modeling Accuracy of Electronic Packages | Accuracy (.pdf) |
336k | Electronic and hard copies |
| Cost/Performance Analysis Of High Pin Count Surface Mount Plastic Packages | BG1001 (.pdf) |
58k | Electronic and hard copies |
| BGA Performance Characteristics: A User's Design Guide | BG1002 (.pdf) |
134k | Electronic and hard copies |
| Flex Tape Ball Grid Array | TG1003 (.pdf) |
136k | Electronic and hard copies |
| ASAT's Tape Ball Grid Array, The Package With Performance | TG1004 (.pdf) |
1308k | Electronic and hard copies |
| The Effect of DA Epoxy Fillet Height on the Induced Stress at the Silicon/Encapsulant Interface of ASAT's TBGA Package | TT1005 (.pdf) |
846k | Electronic and hard copies |
| Thermo-Mechanical Effect of Different Critical Components on ASAT's Tape Ball Grid Array | TT1007 (.pdf) |
522k | Electronic and hard copies |
| The Effects of Component Geometry on the Deformation of the TBGA package | TG1008 (.pdf) |
401k | Electronic and hard copies |
| Curing Characteristics of Selected Die Attach Adhesives | TG1010 (.pdf) |
404k | Electronic and hard copies |
| Electrical Characterization Study of ASAT 2 Layer 256 PBGA | PE1011 (.pdf) |
133k | Electronic and hard copies |
| Encapsulation Selection, Characterization and Reliability for fpBGA | FG1020 (.pdf) |
542k | Electronic and hard copies |
| CSP Reliability: Meeting The Challenges | FG1021 (.doc) |
137k | Electronic and hard copies |
| An Experimental Investigation on the Correlation between Testing Cycles and Delamination of Plastic Ball Grid Array Packages under Thermal Cycling with High Humidity | TT1024 (.pdf) |
681k | Electronic and hard copies |
| Transition from Plastic Ball Grid Array to High Performance Wire Bondable Tape Ball Grid Array | TG1025 (.pdf) |
391k | Electronic and hard copies |
| Choosing the Correct Chip Size Package for the Right Application | BG1027 (.pdf) |
124k | Electronic and hard copies |
| Performance Enhancements in EDQUAD Plastic Packages | DG1030 (.pdf) |
28k | Electronic and hard copies |
| Thermal Performance of 208ld EDQUAD and POWERQUAD® packages | DT1031 (.pdf) |
496k | Electronic and hard copies |
| The Effects of the Bondpad And Soldersphere Sizes on the Ball-Shear Strength of fpBGA Packages | FG1033 (.pdf) |
56k | Electronic and hard copies |
| POWERQUAD® is a registered trademark of Amkor Technology. BG: General BGA FG: General fpBGA PG: General PBGA TG: General TBGA FE: fpBGA Electrical FT: fpBGA Thermal TE: TBGA Electrical TT: TBGA Thermal PE: PBGA Electrical ET: EPP Thermal DG: EDQUAD General DE: EDQUAD Electrical |
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