ASAT - Leadless Products - LPCC

LPCC™ / QFN
Leadless Plastic Chip Carrier

The LPCC patented plastic package was developed by ASAT in 1998, introducing a "leadless" concept into ASAT's expanding portfolio. The LPCC package is a superior choice for high-speed applications where thermal and electrical performance is paramount and space constraints are unavoidable. For thermal solutions, this package has the ability to mount the die attach pad directly to the board for heat dissipation.

Click here to download ASAT's data sheet on LPCC.

Typical Cross-section

US Pat. 6,229,200
US Pat. 6,242,281
US Pat. 6,294,100
US Pat. 6,545,347
US Pat. 6,585,905
US Pat. 6,940,154

Advantages

Green and lead-free options available
Lowest stress at solder joint
compared to CSP & Flex packages
Saw singulation technique provides larger die pads for better thermal performance
Very low inductance for high-speed
applications
Ten day design cycle time including
lead frame
Immune to die shrink
Die pad mounting to motherboard provides for excellent thermal performance

Also available in:

JEDEC:

JEDEC MO-220I (.pdf)

Typical Applications

ASICs, DSP, ASSP
High-speed networks
Personal digital assistants
RF applications
Telecommunications

Bonding Diagrams and MODs

JEDEC MO-220I
Size	I/O	Pitch	DAP Size (mils)	No Ground Ring	With Ground Ring	MOD
3x3	12	0.65	75x75	11603027-0-01		DGMJ00005 Rev-C.pdf
3x3	16	0.50	75x75	E11603072-0-01	E11603074-0-01	DGMJ00005 Rev-C.pdf
4x4	16	0.65	114x114	E11604080-0-01		DGMJ00005 Rev-C.pdf
4x4	24	0.50	114x114	E11604082-0-01	11604057-0-01	DGMJ00005 Rev-C.pdf
5X5	20	0.65	154X154	E11605098-1-01		DGMJ00005 Rev-C.pdf
	24	0.65			E11605099-1-01	DGMJ00005 Rev-C.pdf
	28	0.50			11605048-0-78	DGMJ00005 Rev-C.pdf
	28	0.50			11605047-1-01	DGMJ00005 Rev-C.pdf
	32	0.50		E11605102-1-01	11605071-0-01	DGMJ00005 Rev-C.pdf
6X6	28	0.65	193X193	E11606046-1-01		DGMJ00005 Rev-C.pdf
	36	0.50			11606021-0-01	DGMJ00005 Rev-C.pdf
	40	0.50		E11606050-1-01	11606032-0-01	DGMJ00005 Rev-C.pdf
7x7	44	0.50	232x232	11607053-0-01		DGMJ00005 Rev-C.pdf
7x7	48	0.50	232x232		11607049-0-01	DGMJ00005 Rev-C.pdf
8X8	44	0.65	272x272	11608014-0-01		DGMJ00005 Rev-C.pdf
8X8	56	0.50	272x272		11608017-0-01	DGMJ00005 Rev-C.pdf
9x9	64	0.50	311x311	E11609040-1-01	11609026-0-01	DGMJ00005 Rev-C.pdf

* Please contact your local sales representative or FAE for assistance.

LPCC™ / QFN Leadless Plastic Chip Carrier

LPCC™ / QFN
Leadless Plastic Chip Carrier