The LPCC patented plastic package was developed by ASAT in 1998, introducing a "leadless" concept into ASAT's expanding portfolio. The LPCC package is a superior choice for high-speed applications where thermal and electrical performance is paramount and space constraints are unavoidable. For thermal solutions, this package has the ability to mount the die attach pad directly to the board for heat dissipation.
A revolutionary new concept, ASAT's TAPP is a leadless, Pb-free and multi-row packaging solution. The very thin, fine-pitch package with an exposed die attach pad allows for improved thermal performance and a power/ground ring option for enhanced electrical characteristics.
The TAPP offers a superior solution for high-performance and chip scale applications.
Available Leadless Data Sheets