The widespread use of plastic packages in the 1990s resulted in an increased requirement for
thermal and electrical performance. ASAT created the EDQUAD family to meet this demand. It provides up to a 50% improvement in power dissipation and a significant reduction in electrical parasitics when compared with standard QFPs. These capabilities make ASAT’s EDQUAD packages an excellent choice for applications requiring enhanced performance.
The EPP Package is ASAT’s packaging solution for cost-effective thermal enhancement of standard leaded packages. When soldered directly to the board, the exposed pad provides a direct thermal path for heat dissipation. When connected directly to a ground plane, the EPP package also reduces loop inductance, which is highly desirable for high-speed applications.
The Int-TEP package uses an embedded anodized aluminum heat spreader to provide thermal enhancement. The heat spreader is attached to the lead frame paddle prior to molding with a thermally-conductive epoxy, ensuring good thermal contact and eliminating voids that could result in hot spots. All MQFP packages are currently offered in this configuration.
ASAT offers a wide range of packages for MQFP, LQFP, and TQFP in various body sizes, lead counts, body thicknesses and footprints. Open-tooled lead frames are available for various die sizes, both in die-up and die-down configurations. Custom lead frame designs are also supported. All standard leaded packages are offered with MSL-1 and lead-free assembly options. Electrical performance enhancement option is available with the addition of an interposer ring.