INT-TEP
Integrated Heat Spreader Package

The Int-TEP package uses an embedded anodized aluminum heat spreader to provide thermal enhancement. The heat spreader is attached to the lead frame paddle prior to molding with a thermally-conductive epoxy, ensuring good thermal contact and eliminating voids that could result in hot spots. All PLCC and MQFP packages are currently offered in this configuration.

Click here to download ASAT's data sheet on leaded products.

Typical Cross-section

 

 

 

Advantages
  • Improved thermal performance versus standard packages
  • Low loop inductance
  • Lead-free and MSL-1 options available
  • Cost effective
  • Standard assembly materials

 

Typical Applications
  • ASICs, graphics, microprocessors
  • High-performance networks
  • High-speed logic/FPGAs
  • Automatic test equipment

 

 

Typical Package Configurations

INT-HS MQFP PACKAGES
EXTERNAL LEAD PITCH
1.0
MM
0.8
MM
0.65
MM
0.5
MM
0.4
MM
BODY SIZE
LEAD COUNT
10.0 MM X 10.0 MM
Thickness: 2.0mm Footprint: 3.2mm, 3.9mm
 
 
 
64
 
14.0 MM X 14.0 MM
Thickness: 2.0mm Footprint: 2.0mm, 3.2mm
Thickness: 2.7mm Footprint: 3.2mm, 3.9mm
 
 
 
 
100
100
 
14.0 MM X 20.0 MM
Thickness: 2.0mm Footprint: 3.2mm, 3.6mm
Thickness: 2.7mm Footprint: 3.2mm, 3.6mm, 3.9mm
 
 
 
100
100
 
 
 
28.0 MM X 28.0 MM
Thickness: 3.49mm Footprint: 2.6mm, 3.2mm, 3.9mm
 
 
 
 
160
208
 
 
32.0 MM X 32.0 MM
Thickness: 3.5mm  Footprint: 2.6mm, 3.2mm
 
 
 
240
 
 
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