EPP
Exposed Pad Package

The EPP Package is ASAT’s packaging solution for cost-effective thermal enhancement of standard leaded packages. When soldered directly to the board, the exposed pad provides a direct thermal path for heat dissipation. When connected directly to a ground plane, the EPP package also reduces loop inductance, which is highly desirable for high-speed applications.

Click here to download ASAT's data sheet on leaded products.

Typical Cross-section

 

 

 

 

Advantages
  • Improved thermal performance
  • Low loop inductance
  • Lead-free options available
  • Standard assembly materials

Also available in:

Typical Applications
  • Wireless telecommunications
  • Disk drives
  • GaAs applications
  • RF modules

 

 

Bonding Diagrams and MODs

Leads
Body Size
Pad Size
Etched/
Stamped
DIE Position
Bond Diagram
Marketing Outline
32L
5x5x1.0 mm
105x105
ETCHED
DIE UP
100L
14x14x1.0 mm
265x265
ETCHED
DIE UP

 

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