Typical Cross-section

Advantages
Typical Applications
- Superior thermal performance
- Internal ground and power rings
- Lead-free options available
- Enhanced electrical performance
- Standard assembly materials
Also available in:
- ASICs, graphics, microprocessors
- High-performance networks
- High-speed logic/FPGAs
- Automatic test equipment
Bonding Diagrams and MODs
Leads |
Body Size |
Pad Size |
Etched/ Stamped |
DIE Position |
Bond Diagram |
Marketing Outline |
32L |
7x7x1.4 mm |
170x170 / 200x200 |
ETCHED |
DIE DOWN |
||
48L |
7x7x1.4 mm |
170x170 / 200x200 |
ETCHED |
DIE DOWN |
||
48L |
7x7x1.4 mm |
170x170 / 200x200 |
ETCHED |
DIE UP |
||
44L |
14x14x1.4 mm |
240x240 / 280x280 |
ETCHED |
DIE DOWN |
||
44L |
14x14x1.4 mm |
330x330 / 370x370 |
ETCHED |
DIE DOWN |
||
52L |
10x10x1.4 mm |
270x270 / 300x300 |
ETCHED |
DIE UP |
- |
|
52L |
10x10x1.4 mm |
270x270 / 300x300 |
ETCHED |
DIE DOWN |
||
52L |
14x14x1.4 mm |
240x240 / 280x280 |
ETCHED |
DIE DOWN |
||
64L |
10x10x1.4 mm |
270x270 / 300x300 |
ETCHED |
DIE DOWN |
||
64L |
14x14x1.4 mm |
240x240 / 280x280 |
ETCHED |
DIE DOWN |
||
64L |
14x14x1.4 mm |
330x330 / 370x370 |
ETCHED |
DIE DOWN |
||
80L |
14x14x1.4 mm |
240x240 / 280x280 |
ETCHED |
DIE DOWN |
||
80L |
14x14x1.4 mm |
330x330 / 370x370 |
ETCHED |
DIE DOWN |
||
80L |
14x14x1.4 mm |
330x330 / 370x370 |
ETCHED |
DIE UP |
||
80L |
14x14x1.4 mm |
350x350 / 390x390 |
ETCHED |
DIE DOWN |
||
100L |
14x14x1.4 mm |
240x240 / 280x280 |
ETCHED |
DIE DOWN |
||
100L |
14x14x1.4 mm |
350x350 / 390x390 |
ETCHED |
DIE DOWN |
||
120L |
14x14x1.4 mm |
240x240 / 280x280 |
ETCHED |
DIE DOWN |
||
120L |
14x14x1.4 mm |
350x350 / 390x390 |
ETCHED |
DIE DOWN |
||
128L |
14x14x1.4 mm |
240x240 / 280x280 |
ETCHED |
DIE DOWN |
||
128L |
14x14x1.4 mm |
330x330 / 370x370 |
ETCHED |
DIE DOWN |
||
128L |
14x14x1.4 mm |
350x350 / 390x390 |
ETCHED |
DIE DOWN |
||
144L |
20x20x1.4 mm |
340x340 / 400x400 |
ETCHED |
DIE DOWN |
||
144L |
20x20x1.4 mm |
440x440 / 500x500 |
ETCHED |
DIE DOWN |




