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ASAT offers a wide range of packages for MQFP, LQFP, and TQFP in various body sizes, lead counts, body thicknesses and footprints. Open-tooled lead frames are available for various die sizes, both in die-up and
die-down configurations. Custom lead frame designs are also supported. All standard leaded packages are offered with MSL-1 and lead-free assembly options. Electrical performance enhancement option is available with the addition of an interposer ring.
Enhanced Disipation QUAD
The widespread use of plastic packages in the 1990s resulted in an increased demand for thermal and electrical performance. ASAT introduced the EDQUAD family to meet this demand. ASAT’s EDQUAD provides up to a 50% improvement in power dissipation and a significant reduction in electrical parasitics when compared with standard QFPs. These capabilities offer an excellent choice for applications requiring enhanced performance.
Exposed Pad Package (EPP)
The EPP is ASAT’s packaging solution for cost-effective thermal enhancement of standard leaded packages. When soldered directly to the board, the exposed pad provides a direct thermal path for heat dissipation. When connected directly to a ground plane, the EPP also reduces loop inductance, which is highly desirable for high-speed applications.
Integrated Heat Slug (INT-HS)
ASAT introduced the Integrated Heat Slug package family for systems and applications requiring moderate thermal performance than otherwise possible with standard leaded packages, providing up to a 40% improvement in power dissipation over a standard QFP without the use of an external radiator. This is achieved by using an exposed copper heat slug, which provides a direct thermal path for the IC chip. The heat slug is attached to the leadframe die attach pad with a thermally-conductive adhesive, thereby eliminating any air gaps and heat spots between these two structures.
Int-TEP™: Integrated Heat Spreader Package
The Int-TEP uses an embedded anodized aluminum heat spreader to provide thermal enhancement. The heat spreader is attached to the lead frame paddle prior to molding with a thermally-conductive epoxy, ensuring excellent thermal contact and eliminating voids that could result in hot spots. All MQFP packages are currently offered in this configuration.
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Thermally Enhanced Leaded Packages: 
Leaded Products