Additional Product Information
Thermally Enhanced Leaded Packages: Data Sheet
Typical INT-TEP Applications
- ASICs, graphics, microprocessors
- High-performance networks
- High-speed logic/FPGAs
- Automatic test equipment
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Enhanced Leaded Products: INT-TEP
Integrated Heat Spreader Package
Typical Cross-Section
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The Int-TEP uses an embedded anodized aluminum heat spreader to provide thermal enhancement. The heat spreader is attached to the lead frame paddle prior to molding with a thermally-conductive epoxy, ensuring excellent thermal contact and eliminating voids that could result in hot spots. All MQFP packages are currently offered in this configuration.
Typical Package Configurations
Type |
Body Size |
Body Thickness |
Footprint |
External Lead Pitch |
Lead Count |
JEDEC Reference Outline |
LQFP |
7 x 7 |
1.4 |
2.0 |
0.50/0.80 |
32/48 |
MS026 |
MQFP |
10 x 10 |
2.0 |
3.2/3.9 |
0.5 |
64 |
MO108/MO112 |
MQFP |
14 x 14 |
2.0/2.7 |
2.0/2.6/3.2 |
0.5 |
100 |
MS022/MO108/MO112 |
MQFP |
14 x 20 |
2.0/2.7 |
3.2/3.6/3.9 |
0.65 |
100 |
MS022/MO112 |
MQFP |
28 x 28 |
3.49 |
2.6/3.2/3.9 |
0.5/0.65 |
160/208 |
MSO22/MS029/MO112 |
MQFP |
32 x 32 |
3.5 |
2.6/3.2 |
0.5 |
240 |
MO108/MS029 |