Enhanced Leaded Products: INT-HS

Integrated Heat-Slug

EDQUAD ASAT introduced the Integrated Heat Slug package family for systems and applications requiring moderate thermal performance than otherwise possible with standard leaded packages, providing up to a 40%
improvement in power dissipation over a standard QFP without the use of an external radiator. This is achieved by using an exposed copper heat slug, which provides a direct thermal path for the IC chip. The heat slug is attached to the leadframe die attach pad with a thermally-conductive adhesive, thereby eliminating any air gaps and heat spots between these two structures.

Features

Available in LQFP and MQFP formats
JEDEC-compliant package outline
Die down or die up configurations
Nickel, Tin, or solder plated exposed heat sink

Advantages

Cost-effective thermal enhancement
Green material set available
Open-tooled leadframes available
Uses standard assembly materials
Directly-attached heat slug eliminates voids

Typical Cross-Section

QFP

Typical Package Configurations

Type	Body Size	Body Thickness	Footprint	External Lead Pitch	Lead Count	JEDEC Reference Outline
LQFP	14 x 14	1.4	2.0	0.4/0.5/0.65/0.8/1.0	44/52/64/80/100/120/128	MS026
LQFP	20 x 20	1.4	2.0	0.50	144	MS026
LQFP	24 x 24	1.4	2.0	0.50	176	MS026
MQFP	14 x 14	2.7	3.2/3.6/3.9	0.5/0.65/0.8/1.0	64/80/100/120/128	MO112
MQFP	14 x 20	2.7	3.2/3.6/3.9	1.0/0.80/0.65/0.50	64/80/100/120/128	MS022/MO112
MQFP	28 x 28	3.49	2.6/3.2/3.9	0.5/0.65/0.8	120/128/144/160/184/208	MS022/MS029/MO112