ASAT - Glossary

Glossary of Terms

This glossary contains definitions and other terms as they relate to our businesses and as they are used in this report. As such, these definitions may not correspond to standard industry definitions.

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Array	A group of items (elements, leads, bonding pads, circuits, etc.) arranged in rows and columns.
BGA	A type of packaging known as ball grid array, where the chip is placed on top of a laminate substrate that has a grid of solder balls underneath connecting the packaged device to a printed circuit board.
Chip	An individual integrated circuit that has not yet been packaged. Also used as a generic term for semiconductor devices.
Chipset	Two or more chips designed to perfonn as a unit for one or more functions.
Chip Scale Packages	Any semiconductor package in which the package is no more than 1.2 times the size of the semiconductor chip.
Co-processor	Semiconductor chip that coordinates and controls the operation of a microprocessor.
Deposition	A term applied to growing thin layers wither in a vacuum condensation mode, or via electroplating techniques.
DVD	Digital video disk.
Encapsulation	Enclosing the die in an organic medium either by transfer mold process or glob top techniques.
Ethernet	A widely used type of local area network (LAN).
fpBGA	Fine Pitch Ball Grid Array. A version of a BGA package, mounted on tape substrate, that has a solder ball pitch of less than 1.0 mm.
fxBGA	A new and flexible advanced BGA package that is thinner, has a higher circuit density and improved electrical and thermal performance.
Field Programmable Logic	A type of semiconductor device which can have its functionality altered via electronic means to conform to a custom application.
Flip Chip	Type of BGA package which uses an array of solder bumps on the bottom of the semiconductor chip to connect the chip to the balls on the bottom of the package.
Global Positioning System (GPS)	A system for identifying locations across the planet.
IDM	Integrated device manufacturer
Input/Output	A connector which interconnects the chip to the package or one package level to the next level in the hierarchy. Also referred to as pin out connections or terminals.
Integrated Circuit (IC)	A combination of two or more transistors on a base material, usually silicon. All semiconductor chips, including memory chips and logic chips, are very complicated integrated circuits with thousands of transistors.
INT - TEP- QFP	A QFP package with an aluminum flag attached to the back of the die paddle to enhance thermal dissipation of the package.
Laminate Substrate	An organic substrate used for the routing of BGA products between the chip pads and the solder ball pads.
Leadframe	A metal frame, connected to the bonding pads of the chip by lead, that provides electrical connection to external points.
Logic Device or System	A device that contains digital integrated circuits that process, rather than store, information.
LPCC	Leadless Plastic Chip Carrier, a leadframe based chip scale package.
Microcontrollers	Similar to microprocessor, but dealing with a simpler information set.
Microprocessor	A standard circuit design that provides functions similar to central processing units by interpreting and executing instructions, usually incorporating arithmetic capabilities.
Mixed Signal Products	Products that can process both digital and analog data.
Molding	Encapsulating the chip, leadframe and wirebondings in molded plastic with leads protruding. The molded plastic is an epoxy based material called "molding compound."
MSL-1 Capability	Process technology which allows our leadframe based packages to achieve moisture sensitive level one.
MSP Technology	Multi-System in a Package Technology is customer specific technology incorporating multi-functions of a circuit in a single package.
Optical Network System	A localized network of personal computers that are connected by high frequency fiber optic lines.
PBGA	Plastic Ball Grid Array, which is a standard BGA package.
Pitch	The center-to-center distance between adjacent leads on a package.
PLCC	Plastic Leaded Chip Carrier which is a standard leaded package.
Power Management System	A class of semiconductor packages that incorporate features to increase the thermal dissipation properties of the package.
Printed Circuit Board	A laminate sheet into which integrated circuits are soldered. Wires on the board connect the circuits with each other, forming a larger functional unit. Printed circuit boards generally are a subsystem within a larger electronic system.
QFP	Quad Flat Pack, which is a semiconductor package with leads on all four sides attached to a printed circuit board by surface mounting.
Routers	Interconnections between two or more data communications networks.
Servers	A centralized computer that either manages a personal computer network or allows decentralized access.
Set-top Box	An electronic device which sits on top of a television to allow cable and/or internet access and can be supported either by phone lines or direct satellite access.
Solder Ball	A tin lead alloy sphere that is attached to a BGA substrate to allow for printed circuit board attachment.
Stacked Die	Two or more die stacked within a single package.
Substrate	The underlying material upon which a device, circuit, or epitaxial layer is fabricated, normally a silicon wafer.
Surface Mount	A circuit board packaging technique in which the leads (pins) on the chips and components are soldered on top of the board.
System Controller	A high performance semiconductor which is the primary control function provider for complex electronic systems.
SiP	System-in-Package is a customer specific technology incorporating multi-functions of a circuit in a single package.
TAPP®	Thin Array Plastic Packaging Technology which provides metallic contacts to the circuit board allowing high density circuitry in a small footprint package.
TBGA	Tape Ball Grid Array, which is a BGA package with a more flexible substrate and higher density than conventional plastic packages.
TQFP	Thin Quad Flat Package, which is a standard leaded package.
Two Layer TBGA	Two level tape process in BGA packaging that doubles the density available in a given area.
Wafer	Thin, round, flat piece of silicon that is the base of most integrated circuits.
Wire Bonding	The method used to attach very fine wire to semiconductor components in order to provide electrical continuity between the semiconductor chip and a terminal.