ASAT - Flip Chip

Flip Chip

Flip chip, which describes the method of attaching a bumped chip onto a substrate, was introduced more than 30 years ago as a method for improving performance. Since that time, high chip speeds and increased I/O and bump densities have become the driving forces behind the evolution of this technology from conventional wire bond packages to current advanced flip chip processes. By partnering with proven industry leaders, ASAT provides the experience and technological expertise to help you sort through the wide variety of available substrate technologies and materials to determine the most efficient technology for your application. ASAT will work with you to define your exact requirements, then provide proven solutions that leverage our solid design, modeling and simulation tools to ensure the highest level of success.

Click here to download ASAT's flip chip data sheet.

Typical Cross Sections

Advantages

Smaller size: smaller IC footprint
Increased functionality: increased I/O, both perimeter and full-area array
Improved performance
- Better high-speed routing: less inductance, resistance and capacitance
- Smaller electrical delays: shorter
  distances from the circuit to the bump
- Good high-frequency characteristics
  due to lower inductance power planes
- Good thermal pathway with access to the backside of the die
- Better power/ground distribution
  minimizing IR drops

Typical Applications

High-frequency applications
Cell phones
Hand-held electronics
Internet workstation processors
High bandwidth communications
Printer applications