Additional Product Information
Thermally Enhanced Leaded Packages: Data Sheet
Typical EPP Applications
- Wireless telecommunications
- Disk drives
- GaAs applications
- RF modules
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Enhanced Leaded Products: EPP
Exposed Pad Package
Typical Cross-Section
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The EPP is ASAT’s packaging solution for cost-effective thermal enhancement of standard leaded packages. When soldered directly to the board, the exposed pad provides a direct thermal path for heat dissipation. When connected directly to a ground plane, the EPP also reduces loop inductance, which is highly desirable for high-speed applications.
Typical Package Configurations
Type |
Body Size |
Body Thickness |
Footprint |
External Lead Pitch |
Lead Count |
JEDEC Reference Outline |
T/LQFP |
5 x 5 |
1.0/1.4 |
2.0 |
0.5 |
32L |
MS026 |
T/LQFP |
12 x 12 |
1.0/1.4 |
2.0 |
0.5 |
80L |
MS026 |
T/LQFP |
14 x 14 |
1.0/1.4 |
2.0 |
0.5 |
100L |
MS026 |
LQFP |
14 x 20 |
1.4 |
2.0 |
0.5 |
128L |
MS026 |
LQFP |
20 x 20 |
1.4 |
2.0 |
0.5 |
144L |
MS026 |