Additional Product Information
Thermally Enhanced Leaded Packages: Data Sheet
Typical EDQUAD Applications
- ASICs, graphics, microprocessors
- High-performance networks
- High-speed logic/FPGAs/PLDs
- Automatic test equipment
Also available in:
U.S. Patents
US Pat. # 5,596,231
US Pat. # 6,285,075
US Pat. # 6,326,678
US Pat. # 6,552,417
US Pat. # 6,724,071
Contact an ASAT Representative
Enhanced Leaded Products: EDQUAD LQFP
Enhanced Dissipation QUAD
|
The widespread use of plastic packages in the 1990s resulted in an increased demand for thermal and electrical performance. ASAT introduced the EDQUAD family to meet this demand. ASAT’s EDQUAD provides up to a 50% improvement in power dissipation and a significant reduction in electrical parasitics when compared with standard QFPs. These capabilities offer an excellent choice for applications requiring enhanced performance.
Typical Package Configurations
Type |
Body Size |
Body Thickness |
Footprint |
External Lead Pitch |
Lead Count |
JEDEC Reference Outline |
MQFP |
10 x 10 |
2.0 |
3.2/3.9/4.1 |
0.8/0.65/0.5 |
44/52/64 |
MO108/MO112 |
MQFP |
14 x 14 |
2.0/2.7 |
2.0/2.6/3.2/3.9 |
1.0/0.8/0.65/0.5 |
44/52/64/80/100 |
MS022/MO108/MO112 |
MQFP |
14 x 20 |
2.0/2.7 |
3.2/3.6/3.9 |
1.0/0.8/0.65/0.5 |
64/80/100/120/128 |
MS022/MO112 |
MQFP |
28 x 28 |
3.49 |
2.6/3.2/3.9 |
0.8/0.65/0.5 |
120/128/144/160/184/208 |
MSO22/MS029/MO112 |
MQFP |
32 x 32 |
3.50 |
2.6/3.2 |
0.65/0.5 |
184/240 |
MO108/MS029 |
LQFP |
5 x 5 |
1.4 |
2.0 |
0.8/0.5 |
20/32 |
MS026 |
LQFP |
7 x 7 |
1.4 |
2.0 |
0.8/0.5 |
32/48 |
MS026 |
LQFP |
10 x 10 |
1.4 |
2.0 |
0.8/0.65/0.5 |
44/52/64 |
MS026 |
LQFP |
14 x 14 |
1.4 |
2.0 |
1.0/0.8/0.65/0.5/0.4 |
44/52/64/80/100/120/128 |
MS026 |
LQFP |
20 x 20 |
1.4 |
2.0 |
0.5/0.4 |
144/176 |
MS026 |