Additional Product Information
TBGA and Closed Loop TBGA-EBGA: Data Sheet
Typical EBGA Applications
- Broadband (internet routers)
- ASIC
- Programmable logic devices
- DSP
- Microprocessor / controllers
- Printers
Contact an ASAT Representative
EBGA
Enhanced Ball Grid Array
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Typical Cross Section
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ASAT’s EBGA is a high density cavity down BGA package with 2, 3, or 4 routable layers. It has a low package profile, suited for high performance (thermal, electrical, design). With a large range of body sizes (15x15 – 45x45 mm), it is fully compatible with SMT board assembly. 
Typical Package Configuration
| Sub: L/Count | Package Size | Ball size (mils) | Pitch,mm |
| 76 | 17X17 | 30 | 1.27 |
| 192 | 21X21 | 30 | 1.27 |
| 380 | 31x31 | 30 | 1.27 |
| 240 | 25X25 | 30 | 1.27 |
| 317 | 35X25 | 30 | 1.27 |
| 352 | 35X35 | 30 | 1.27 |
| 352 | 35X35 | 30 | 1.27 |
| 584 | 37.5X37.5 | 30 | 1.27 |
| 812 | 37.5X37.5 | 25 | 1.00 |
| 560 | 42.5X42.5 | 30 | 1.27 |
| 728 | 42.5X42.5 | 20 | 1 |
| 1,036 | 45X45 | 25 | 1.00 |