DFN

Dual Flat No-lead

DFN

The DFN package is a superior choice for high-speed applications where thermal and electrical performance is paramount and space constraints are unavoidable.

Features

Body sizes from
2 to 3 mm SQ
Standard assembly materials, equipment and processes
0.40 mm, 0.75 mm, 0.90 mm thickness options
Conforms with
JEDEC MO-229

Advantages

Lowest stress at solder joint compared to CSP & Flex packages
Saw singulation technique provides larger die pads for better thermal performance
Very low inductance for high-speed applications
Die pad mounting to motherboard provides for excellent thermal performance