CSP (Chip Scale Package) Products

LPCC Developed in 1998, ASAT’s fpBGA entered the chip scale packaging market offering a competitive solution for mobile applications, with package height ranging from 1.4mm down to 0.6mm thin package, and with ball pitches from 0.4mm & up. ASAT’s fpBGA package is an excellent choice for application requiring enhanced electrical performance.

Learn more...

Ultra-Thin Fine-Pitch Ball Grid Array

ASAT's Ultra-thin fpBGA offers a thinner profile in a standard fpBGA. Package thickness available in 0.6 and 0.8 mm.

ufpbga

Land Grid Array (LGA)

With it's cost effective and increased electrical performance advantages, ASAT's LGA could be a viable solution to your BGA needs.

LGA