TBGA/CLTBGA
Tape Ball Grid Array/Closed-Loop Tape Ball Grid Array
Developed and patented in 1995, ASAT’s TBGA and Closed-Loop TBGA packages provide the industry with a higher performance solution to the QFP. ASAT’s TBGA package is an excellent choice for applications requiring enhanced thermal and electrical performance. ASAT’s CLTBGA option provides solid ground for improved signal-to-noise ration and reduced ground inductance. The ultra-fine metal line width and spacing allows most designs to be routed on one metal layer. A two-metal option provides multiple power supply rings and improved routability for high ball count applications, typically above 600.
Click here to download ASAT's data sheet on thermally enhanced array products.
Advantages
- JEDEC standard body sizes and ball counts
- High performance (thermal/electrical and design density)
- Internal heat spreader as ground plane
- Low tooling cost (open tool designs also available)
- Fast design to production
Also available in:
Typical Package Configurations
|
BODY SIZE (mm)
|
BALL COUNT
|
PITCH (mm)
|
|
21 X 21
|
156
|
1.27
|
|
23 X 23
|
208/320
|
1.27
|
|
25 X 25
|
320
|
1.0
|
|
27 X 27
|
256
|
1.27
|
|
31 X 31
|
304
|
1.27
|
|
35 X 35
|
352/420/504
|
1.27
|
|
40 X 40
|
600
|
1.27
|
Bonding Diagrams and MODs
Please contact your local sales or FAE representative for any assistance.
