
• Best thermal performance in class
• JEDEC standard body sizes and ball counts
• High performance (thermal/electrical and design density)
• Internal heat spreader as ground plane and EMI shield
• Low tooling cost (open tool designs also available)
• Fast design to production
Features
• Body sizes from 15 to 45 mm SQ
• Lead counts from 46 to 792
• Die-down configuration
• One to two metal layer tape design, with and without bussing
• Ground ring on heat spreader or tape
• Option for electrically conductive spot on cavity
• Conforms to JEDEC registered
outlines for MO-149
• Controlled impedance / differential pairs capability
Applications
• ASICs, graphics, microprocessors• High performance networks
• Laptops, workstations
• High-speed logic devices




