ASAT - Array Products

PBGA
Plastic Ball Grid Array

The PBGA provides electrical and design enhancements over leaded packages. Using ASAT's design and modeling services, 2-6L laminate can be designed with power and ground planes for enhancing electrical and thermal performance.

Click here to download ASAT's data sheet on standard array products.

Typical Cross-section

Advantages

Performance adders - ground/power planes
Low inductance, improved thermals
JEDEC compliant
Standard eutectic or lead-free material set available.

Also available in:

System-in-Package
Stacked Die
Flip Chip

Typical Applications

Microprocessors
Networking chip sets
Personal computer chip sets
Graphics, DSPs

Typical Package Configurations

BODY SIZE (mm)	BALL COUNT	PITCH (mm)
13 x 13	144	1.0
15 x 15	196	1.0
14 x 22	119/153	1.27
23 x 23	169	1.5
23 x 23	208/217	1.27
27 x 27	225	1.5
27 x 27	256/272	1.27
35 x 35	352/388	1.27

Bonding Diagrams and MODs

Please contact your local sales or FAE representative for any assistance.

PBGA Plastic Ball Grid Array

PBGA
Plastic Ball Grid Array