fpBGA
Fine Pitch Ball Grid Array

Developed in 1998, ASAT’s fpBGA entered the chip scale packaging market offering a competitive solution for mobile applications, with package height ranging from 1.4mm down to 0.6mm thin package, and with ball pitches from 0.4mm & up. ASAT’s fpBGA package is an excellent choice for application requiring enhanced electrical performance.

ASAT's LGA (Land Grid Array). With its cost effective and increased electrical performance advantages, the LGA could be a viable solution to your BGA needs.

Click here to download ASAT's data sheet on standard array products.

Typical Cross-section

Standard fpBGA

 

 

LGA

 

 

Advantages
Standard fpBGA
  • Typical Applications
    • ASICS, microprocessors/controllers.
    • Networking, graphic & PC chipsets,
    • PLDs, DSP, mix signals,
    • Gate Arrays, memory,
  • Advantages
    • Superior electrical performance
    • Thermal enhancement
    • Low profile, small footprint, light weight
    • Lead free and ‘Green’ material sets available
  • Features
    • Body sizes from 4 to 27 sq mm
    • Open and custom ball counts from 24 - 672
    • Package thickness 0.6 / 0.8 / 1.0 / 1.2 / 1.4 / 1.7mm
    • Ball Pitch 0.4, 0.5, 0.65, 0.80 and 1.00mm
    • Die-up configuration

 

Also available in:

LGA

  • Lower profile
  • Enhanced electrical performance
  • Reduced cost

 

Typical Package Configurations

Package
 Dimension
I/O
Ball Pitch
B-fpBGA
10.16X11.43
36
1.27
>1.7mm 
9X11
24
1.27
F-fpBGA
21x21
256, 316
1.00
 >1.7mm
23x23
484
1.00
 
25x25
529
1.00
 
27x27
672
1.00
 
35x35
388
1.27
L-fpBGA
4x4
24
0.80
 1.7mm max
5x5
32, 36
0.5, 0.8
 
5.5x16
114
0.80
 
6x6
36, 48, 56
0.5, 0.8
 
6.0x5.35
26
0.65
 
6x9
48
0.80
 
7x7
48, 49, 64, 81, 100, 104
0.5, 0.65, 0.75, 0.8
 
7x8
48
0.75
 
7x12
48, 54
0.5, 0.75
 
8x8
 64, 72, 80, 100
0.65, 0.8
 
8x9
48
0.80
 
9x9
64, 80, 100, 113
0.8, 1.0
 
10x10
100, 108, 109
140, 144, 165, 296, 302
0.5, 0.8, 1.0
 
10x12
48
1.00
 
10x14
48, 117
1.00
 
11x11
64, 100, 169, 282, 355
0.5, 0.8, 1.0
 
12x12
121, 160, 168
180, 196, 204, 276
0.65, 0.8, 1.0
 
12x7
47
0.50
 
12x16
130
0.80
Package
 Dimension
I/O
Ball Pitch
L-fpBGA
13x13
132, 144, 160, 176
200, 225, 256, 417, 517
0.5, 0.8, 1.0
1.7mm max 
13x10
48
1.00
 
15x15
176, 196, 208, 289, 301, 324, 448
0.65, 0.8, 1.0
 
17x17
192, 220, 256, 329
0.8, 1.0
 
19x19
324
1.0
 
21x21
256, 316, 400
1.0
T-fpBGA
4x4
49
0.5
 1.2mm max
5x5
41, 49, 52, 65
0.5, 0.65
 
5.7x5
25
0.75
 
6x6
56, 95, 96
0.5
 
7x7
48, 100, 144
0.5, 0.75
 
7x12
54
1.0
 
8x8
64, 100
0.5, 0.8
 
8x10
48
0.8
 
10x10
112, 164, 281
0.5
 
10x13
54, 64, 80
1.0
 
10.1x10.9
281
0.5
 
12x12
160
0.8
 
13x13
132
1.0
V-fpBGA
4.5x7
52
0.65
1.0mm max
5x5
80
0.5

 

6x6
96
0.5
 
10x10
192
0.5

Bonding Diagrams and MODs

Please contact your local sales or FAE representative for any assistance.