EBGA
Enhanced Ball Grid Array

ASAT's EBGA is a high density cavity down BGA package with 2, 3, or 4 routable layers. It has a low package profile, suited for high performance (thermal, electrical, design). With a large range of body sizes (17x17 – 45 x 45 mm), it is fully compatible with SMT board assembly.

Click here to download ASAT's EBGA data sheet.

 

Typical Cross-section

Advantages
  • High density cavity down BGA package
  • 2, 3, or 4 routable layers
  • High performance (thermal, electrical, design)
  • Large range of body sizes (17x17 – 45x45 mm)
  • Fully compatible with SMT board assembly
  • Flexible thermal option for PBGA with same substrate layout
  • JEDEC compliant MS-034
Typical Applications
  • Broadband (internet routers)
  • ASIC
  • Programmable logic devices
  • DSP
  • Microprocessor / controllers
  • Printers

Typical Package Configurations

Sub: L/Count Package Size  Ball size   (mils) Pitch,mm
76 17X17 30 1.27
192 21X21 30 1.27
380 31x31 30 1.27
240 25X25 30 1.27
317 35X25 30 1.27
352 35X35 30 1.27
352 35X35 30 1.27
584 37.5X37.5 30 1.27
812 37.5X37.5 25 1.00
560 42.5X42.5 30 1.27
728 42.5X42.5 20 1
1,036 45X45 25 1.00
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