Developed and patented in 1995, ASAT’s TBGA and Closed-Loop TBGA packages provide the
industry with a higher performance solution to the QFP. ASAT’s TBGA package is an excellent choice for applications requiring enhanced thermal and electrical performance. ASAT’s CLTBGA option provides solid ground for improved signal-to-noise ration and reduced ground inductance. The ultra-fine metal line width and spacing allows most designs to be routed on one metal layer. A two-metal option provides multiple power supply rings and improved routability for high ball count applications, typically above 600.
ASAT's EBGA is a high density cavity down BGA package with 2, 3, or 4 routable layers. It has a low package profile, suited for high performance (thermal, electrical, design).
With a large range of body sizes (15x15 – 50x50 mm), it is fully compatible with SMT board assembly.
The Thermally Enhanced fpBGA is a viable option for the fpBGA with its great thermal performance. ASAT's extensive history and experience with this process makes this package a most attractive option.
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TBGA / CLTBGA EBGA Thermally Enhanced fpBGA
The PBGA provides electrical and design enhancements over leaded packages. Using ASAT's design and modeling services, 2-6L laminate can be designed with power and ground planes for enhancing electrical and thermal performance.
Developed in 1998, ASAT's fpBGA packaged entered the chip scale market offering a competitive solution for hand held products.
PBGA Standard fpBGA or Thermally Enhanced fpBGA
LGA (Land Grid Array)
The LGA offers a cost-effective alternative to the BGA. With its lower profile due to the absence of of solder balls, the increased electrical performance (lower inductance) is an attractive option.
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The flip chip process, which involves attaching a bumped chip onto a substrate, was introduced more than 30 years ago as a method for improving performance. Since that time, high chip speeds and increased I/O and bump densities have become the driving force behind the evolution of this technology from conventional wire bond packages to current flip chip processes. ASAT provides the experience and technological expertise to help you sort through the wide variety of available substrate technologies and material to determine the most efficient technology for your application. ASAT will work with you to define your exact requirements, then provide proven solutions that leverage our solid design, modeling, and simulation tools to endure the highest level of success.
Available Array Data Sheets
TBGA/CLTBGA: Data sheet, EBGA: Data sheet | All: Application Notes
PBGA: Data sheet, fpBGA: Data sheet | Applications Notes
Flip Chip: Data sheet