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 The PBGA provides electrical and design enhancements over leaded packages. Using ASAT’s design and modeling services, 2-6L laminate can be designed with power and ground planes for enhancing thermal and electrical performance. ASAT’s PBGA is available as open tooled or custom laminate with the option of standard eutectic or lead free material sets.
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 Developed and patented in 1995, ASAT’s TBGA and CLTBGA packages provide the industry with a higher performance solution to PBGA. ASAT’s TBGA package is an excellent choice for applications requiring enhanced thermal and electrical performance. ASAT’s CLTBGA option provides solid electrical ground for improved signal-to-noise ratio and reduced ground inductance. The ultra-fine metal line width and spacing allows most designs to be routed on one metal layer. A two-metal option provides multiple power supply rings and improved routability for higher ball count applications, typically above 600.
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 ASAT’s EBGA is a high density cavity down BGA package with 2, 3, or 4 routable layers. It has a low package profile, suited for high performance (thermal, electrical, design). With a large range of body sizes (15x15 – 45x45 mm), it is fully compatible with SMT board assembly.
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TBGA and Closed Loop TBGA-EBGA: Data Sheet
Ball Grid Array Products