ASAT Highlights
ASAT China awarded ISO 9001 certificate upgrade
Unisem and ASAT Limited Enter Into Cross Licensing Agreement
of Key Advanced Leadless Semiconductor Packaging Technologies
ASAT Licenses Amkor’s FusionQuad® Package Technology
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"Thin" QFN, TAPP® and fpBGA Packages
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ASAT Inc.
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Suite 200
Milpitas, California 95035
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F: 408-964-5535
Press Room
December 17, 2008
ASAT Holdings Announces Financial Results For The First Quarter of Fiscal Year 2009
July 31, 2008
ASAT Holdings Announces Financial Results For The Fourth Quarter And Fiscal Year 2008
March 28, 2008
ASAT Holdings Announces Financial Results For The Third Quarter
of Fiscal Year 2008
ASAT Holdings Limited Celebrates 20 Years Of Superior Semiconductor Packaging Service
Milestone Accentuated With Renewed Focus
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ASAT Receives Supplier Award for Excellence in Technical Support for the Second Year.
On June 25, 2008, at Exar's 16th Annual Supplier Conference, in Fremont, California, ASAT again received recognition for the Company's exceptional technical support. The award clearly demonstrates ASAT's commitment to customer service, support, and exceptional quality.
"Thin" QFN, TAPP® and fpBGA Packages
by Kelly R. McKendrick Sr.
Senior Field Applications Engineer, ASAT, Inc.
MEPTEC Report, Q208
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"How to Meet the Demand for Smaller Packages without Sacrificing Performance" MEPTEC Report, Quarter Three 2005
By Sanjeet Uppal, Sales Manager, ASAT Inc.
"High Density Package Design: Meeting the Demand" Advanced Packaging Magazine, May 2005
By Javed Sandhu, senior manager of Design Services, and Ed Varga, communications coordinator, ASAT Inc.
"The 'Other' Tin Issue: Tin Pest" Advanced Packaging Magazine, April 2005 By Leo M. Higgins III, Ph. D., Director of Applications Engineering, ASAT, Inc.
"Components" Leadfreemagazine.com
By Leo M. Higgins III, Ph. D., Director of Applications Engineering, ASAT, Inc.