ASAT’s 560,000 square foot state-of-the-art facility is one of the largest and most advanced semiconductor subcontract assembly and test manufacturing facilities in China. Strategically located in Dongguan, China, about 90 minutes from Hong Kong, the facility offers higher productivity, improved efficiency, and close proximity to ASAT’s key end users. ASAT has invested in the latest generation ERP systems, which deliver better real-time visibility and control of the Company’s manufacturing process across its different manufacturing operations. In addition, ASAT offers production lines for the most advanced packaging technologies, including its leading quad flat no-lead (QFN) technology with its Leadless Plastic Chip Carrier (LPCC), fine pitch BGA, Flip Chip, Thin Array Plastic Package (TAPP™), and enhanced leaded packages. ASAT’s China facility is ready to meet the growing demand for smaller, faster and more cost effective high-performance devices.
ASAT continues to expand into new market sectors and develop leading-edge packaging technologies as the outsource assembly market, driven by fabless semiconductor manufacturers and integrated device manufacturers, increases. ASAT is making advancements in all business sectors, including communications, consumer, computing, industrial, and automotive markets with advanced technologies including the fine pitch BGA, LPCC, TAPP™, and high-end thermal performance solutions.
ASAT's test capabilities in mixed-signal, RF, and high-speed digital devices allow the Company to meet the increased demand for outsourced IC package testing. With 50,000 square feet of production test floor, and another 50,000 square feet ready for expansion, ASAT is ready to support your growing IC package test needs.
Package interconnect design has become a critical element in semiconductor manufacturing, impacting device performance as well as board-level and system integration. ASAT provides state-of-the-art packaging design tools and highly qualified engineers required to support all types of substrate, lead frame, flip chip, and modular package designs. The Company's worldwide design centers offer satellite design support for immediate package design needs.
ASAT continues to expand its advanced packaging capabilities to meet the growing demand for smaller, faster, and more cost effective high-performance devices. ASAT offers a variety of packages in the BGA family that include thermally enhanced and two layer tape ball grid arrays (TBGA), and fine pitch ball grid arrays (fpBGA). The Company's fpBGA technology offers multi-layer substrates and bus-less design options for better electrical performance. The fpBGA is available in lead free, and lead-free green configurations, and is also offered in multi-chip and stacked die versions. ASAT's QFN (LPCC™) technology is a superior choice for high-speed applications where thermal and electrical performance is paramount and space constraints unavoidable. ASAT's TAPP® technology moves the Company to the next level of leadless product solutions with a higher I/O capability (few pins to 400 I/O, plus). ASAT has recently converted QFP production to large format matrix leadframes to meet the continuing growth in demand for this standard package.
As performance requirements, such as high-speeds, smaller component footprint, increased I/O, and bump densities drive the demand for flip chip technology, ASAT, in keeping with its technology leadership, is continuing to advance its flip chip capabilities. Flip chip production volumes are increasing as the semiconductor industry moves towards more sophisticated and performance oriented technologies
The Company also offers thermally enhanced and standard leaded package configurations including the MQFP, TQFP, LQFP, EPP, and INT-TEP. Most package configurations are available with thermal dissipation enhancement options. ASAT is ISO/TS 16949, ISO 9001, ISO 14001, and SAC level one certified.