ASAT’s 560,000 square foot state-of-the-art facility is one of the largest and most advanced semiconductor subcontract assembly and test manufacturing facilities in China.

Strategically located in Dongguan, China, about 90 minutes from Hong Kong, the facility offers higher productivity, improved efficiency, and close proximity to ASAT’s key end users. ASAT has invested in the latest generation ERP systems, which deliver better real-time visibility and control of the Company’s manufacturing process across its different manufacturing operations. In addition, ASAT offers production lines for the most advanced packaging technologies, including its leading quad flat no-lead (QFN) technology with its Leadless Plastic Chip Carrier (LPCC), fine pitch BGA, Flip Chip, Thin Array Plastic Package (TAPP™), and enhanced leaded packages. ASAT’s China facility is ready to meet the growing demand for smaller, faster and more cost effective high-performance devices.

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