Featured Product
ASAT's Fine-Pitch Ball Grid Array
- Multi-layer Capability and Bus-less Design Option for Better Electrical Performance
- No Mold Retooling for New Body Sizes
- Short Electrical Path; Thus Low Parasitic
- Immune to Die Shrink
- Size and Density Advantage
- Multi-Chip & Stack Die Capable
- Lead Free / Green qualified
Contact your local ASAT representative for more information; or click here to fill out a product request form.
ASAT News & Events
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ASAT Holdings Limited Celebrates 20 Years Of Superior Semiconductor Packaging Service Milestone Accentuated With Renewed Focus Read more |
| Featured Article | |
“Thin” QFN, TAPP® and fpBGA Packages |
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June 25, 2008
ASAT Receives Supplier Award for Excellence in Technical Support for the Second Year. Read more...
ASAT Holdings Limited Commences Trading On The Over The Counter Bulletin Board Under The Symbol ASTTY.OB